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64Mx72 bits Low Profile Registered DDR SDRAM DIMM HYMD264G726B(L)8M-M/K/H/L
DESCRIPTION
Preliminary
Hynix HYMD264G726B(L)8M-M/K/H/L series is Low Profile registered 184-pin double data rate Synchronous DRAM Dual In-Line Memory Modules (DIMMs) which are organized as 64Mx72 high-speed memory arrays. Hynix HYMD264G726B(L)8M-M/K/H/L series consists of eighteen 32Mx8 DDR SDRAM in 400mil TSOP II packages on a 184pin glass-epoxy substrate. Hynix HYMD264G726B(L)8M-M/K/H/L series provide a high performance 8-byte interface in 5.25" width form factor of industry standard. It is suitable for easy interchange and addition. Hynix HYMD264G726B(L)8M-M/K/H/L series is designed for high speed of up to 133MHz and offers fully synchronous operations referenced to both rising and falling edges of differential clock inputs. While all addresses and control inputs are latched on the rising edges of the clock, Data, Data strobes and Write data masks inputs are sampled on both rising and falling edges of it. The data paths are internally pipelined and 2-bit prefetched to achieve very high bandwidth. All input and output voltage levels are compatible with SSTL_2. High speed frequencies, programmable latencies and burst lengths allow variety of device operation in high performance memory system. Hynix HYMD264G726B(L)8M-M/K/H/L series incorporates SPD(serial presence detect). Serial presence detect function is implemented via a serial 2,048-bit EEPROM. The first 128 bytes of serial PD data are programmed by Hynix to identify DIMM type, capacity and other the information of DIMM and the last 128 bytes are available to the customer.
FEATURES
* * * * * * * 512MB (64M x 72) Low Profile Registered DDR DIMM based on 32Mx8 DDR SDRAM JEDEC Standard 184-pin dual in-line memory module (DIMM) Error Check Correction (ECC) Capability Registered inputs with one-clock delay Phase-lock loop (PLL) clock driver to reduce loading 2.5V +/- 0.2V VDD and VDDQ Power supply All inputs and outputs are compatible with SSTL_2 interface * * * * * * * Fully differential clock operations (CK & /CK) with 100MHz/125MHz/133MHz Programmable CAS Latency 2 / 2.5 supported Programmable Burst Length 2 / 4 / 8 with both sequential and interleave mode tRAS Lock-out function supported Internal four bank operations with single pulsed RAS Auto refresh and self refresh supported 8192 refresh cycles / 64ms
ORDERING INFORMATION
Part No.
HYMD264G726B(L)8M-M HYMD264G726B(L)8M-K HYMD264G726B(L)8M-H HYMD264G726B(L)8M-L VDD=2.5V VDDQ=2.5V
Power Supply
Clock Frequency
133MHz (*DDR266:2-2-2) 133MHz(*DDR266A)
Interface
Form Factor
SSTL_2 133MHz(*DDR266B) 100MHz (*DDR200)
184pin Low Profile Registered DIMM 5.25 x 1.2 x 0.15 inch
* JEDEC Defined Specifications compliant
This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev. 0.1 / Oct. 2003 1
HYMD264G726B(L)8M-M/K/H/L
PIN DESCRIPTION
Pin CK0, /CK0 CS0, CS1 CKE0, CKE1 /RAS, /CAS, /WE A0 ~ A12 BA0, BA1 DQ0~DQ64 CB0~CB7 DQS0~DQS7 DM0~8 VDD /RESET Pin Description Differential Clock Inputs Chip Select Input Clock Enable Input Commend Sets Inputs Address Bank Address Data Inputs/Outputs Data Strobe Inputs/Outputs Data Strobe Inputs/Outputs Data-in Mask Power Supply Reset Enable Pin VDDQ VSS VREF VDDSPD SA0~SA2 SCL SDA WP VDDID DU NC FETEN Pin Description DQs Power Supply Ground Reference Power Supply Power Supply for SPD E2PROM Address Inputs E2PROM Clock E2PROM Data I/O Write Protect Flag VDD Identification Flag Do not Use No Connection FET Enable
PIN ASSIGNMENT
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 Name VREF DQ0 VSS DQ1 DQS0 DQ2 VDD DQ3 NC /RESET VSS DQ8 DQ9 DQS1 VDDQ DU DU VSS DQ10 DQ11 CKE0 VDDQ DQ16 DQ17 DQS2 VSS A9 DQ18 A7 VDDQ DQ19 53 54 55 56 57 58 59 60 61 Pin 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 Key DQ32 VDDQ DQ33 DQS4 DQ34 VSS BA0 DQ35 DQ40 Name A5 DQ24 VSS DQ25 DQS3 A4 VDD DQ26 DQ27 A2 Vss A1 CB0 CB1 VDD DQS8 A0 CB2 VSS CB3 BA1 Pin 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 Name VDDQ /WE DQ41 /CAS VSS DQS5 DQ42 DQ43 VDD NC DQ48 DQ49 VSS DU DU VDDQ DQS6 DQ50 DQ51 VSS VDDID DQ56 DQ57 VDD DQS7 DQ58 DQ59 VSS WP SDA SCL Pin 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 Name VSS DQ4 DQ5 VDDQ DM0 DQ6 DQ7 VSS NC NC A13* VDDQ DQ12 DQ13 DM1 VDD DQ14 DQ15 CKE1 VDDQ BA2* DQ20 A12 VSS DQ21 A11 DM2 VDD DQ22 A8 DQ23 145 146 147 148 149 150 151 152 153 Pin 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 key VSS DQ36 DQ37 VDD DM4 DQ38 DQ39 VSS DQ44 Name VSS A6 DQ28 DQ29 VDDQ DM3 A3 DQ30 VSS DQ31 CB4 CB5 VDDQ CK0 /CK0 VSS DM8 A10 CB6 VDDQ CB7 Pin 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 Name /RAS DQ45 VDDQ /CS0 /CS1 DM5 VSS DQ46 DQ47 NC VDDQ DQ52 DQ53 NC, FETEN* VDD DM6 DQ54 DQ55 VDDQ NC DQ60 DQ61 VSS DM7 DQ62 DQ63 VDDQ SA0 SA1 SA2 VDDSPD
* These are not used on this module but may be used for other module in 184pin DIMM family
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HYMD264G726B(L)8M-M/K/H/L
FUNCTIONAL BLOCK DIAGRAM
/RCS1 /RCS0
DQS0 DM0
DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7
.
/CS DQS
DQS4 DM4
DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 /CS DQS DQ32 DQ33 DQ34 DQ35 DQ36 DQ37 DQ38 DQ39 DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 /CS DQS DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 /CS DQS
DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7
D0
D9
D4
D13
DQS1 DM1
DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 /CS DQS DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 /CS DQS
DQS5 DM5
DQ40 DQ41 DQ42 DQ43 DQ44 DQ45 DQ46 DQ47 DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 /CS DQS DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 /CS DQS
D1
D10
D5
D14
DQS2 DM2
DQ16 DQ17 DQ18 DQ19 DQ20 DQ21 DQ22 DQ23 DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 /CS DQS DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 /CS DQS
DQS6 DM6
DQ48 DQ49 DQ50 DQ51 DQ52 DQ53 DQ54 DQ55 DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 /CS DQS DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 /CS DQS
D2
D11
D6
D15
DQS3 DM3
DQ24 DQ25 DQ26 DQ27 DQ28 DQ29 DQ30 DQ31 DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 /CS DQS DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 /CS DQS
DQS7 DM7
DQ56 DQ57 DQ58 DQ59 DQ60 DQ61 DQ62 DQ63 DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 /CS DQS DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 /CS DQS
D3
D12
D7
D16
DQS8 DM8
CB0 CB1 CB2 CB3 CB4 CB5 CB6 CB7
Serial PD DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 /CS DQS DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 /CS DQS SCL WP SDA
D8
D17
A0 SA0
A1 SA1
A2 SA2
VDDSPD VDDQ VDD VREF VSS
/CS0 /CS1 BA0-BA1 A0-A12 /RAS /CAS CKE0 CKE1 /WE PCK /PCK
R E G
/RCS0 -->/CS0 : SDRAMs D0-D8 /RCS1-->/CS1 : SDRAMs D9 - D17 RBA0-RBA1--> : BA0-BA1:SDRAMs D0-D17 RA0 -R A12 -->A0 - A12 : SDRAMs D0 - D17 /RRAS --> /RAS : SDRAMs D0 - D17 /RCAS --> /CAS : SDRAMs D0 - D17 RCKE0 --> CKE : SDRAMs D0 - D8 RCKE1 --> CKE : SDRAMs D9-D17 /RWE --> /WE : SDRAMs D0 - D17 /RESET
VDDID
. . =. .... ..
==
.
=
.
SPD D0 - D17 D0 - D17 D0 - D17 D0 - D17
Strap:see Note 4
CK0, /CK0 --------- PLL* * Wire per clock loading table/wiring diagrams
Notes: 1. DQ-to-I/O wiring may be changed within a byte 2. DQ/DQS/DM/CKE/S relationships must be maintained as shown. 3. DQ/DQS resistors should be 18 Ohms. 4. VDDID strap connections(for memory device VDD, VDDQ); Strap out :(open) : VDD=VDDQ Strap In (Vss) : VDD=VDDQ 5. /RS0 and /RS1 alternate btw the back and front sides of the DIMM 6. Address and control resistors should be 22 Ohms
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HYMD264G726B(L)8M-M/K/H/L
ABSOLUTE MAXIMUM RATINGS
Parameter Ambient Temperature Storage Temperature Voltage on Any Pin relative to VSS Voltage on VDD relative to VSS Voltage on VDDQ relative to VSS Output Short Circuit Current Power Dissipation Soldering Temperature Time TA TSTG VIN, VOUT VDD VDDQ IOS PD TSOLDER Symbol 0 ~ 70 -55 ~ 125 -0.5 ~ 3.6 -0.5 ~ 3.6 -0.5 ~ 3.6 50 18 260 / 10 Rating
o o
Unit C C
V V V mA W
o
C / Sec
Note : Operation at above absolute maximum rating can adversely affect device reliability
DC OPERATING CONDITIONS (TA=0 to 70 oC, Voltage referenced to VSS= 0V)
Parameter Power Supply Voltage Power Supply Voltage Input High Voltage Input Low Voltage Termination Voltage Reference Voltage VDD VDDQ VIH VIL VTT VREF Symbol Min 2.3 2.3 VREF + 0.15 -0.3 VREF - 0.04 0.49*VDDQ Typ. 2.5 2.5 VREF 0.5*VDDQ Max 2.7 2.7 VDDQ + 0.3 VREF - 0.15 VREF + 0.04 0.51*VDDQ Unit V V V V V V 3 2 1 Note
Note : 1. VDDQ must not exceed the level of VDD. 2. VIL (min) is acceptable -1.5V AC pulse width with < 5ns of duration. 3. The value of VREF is approximately equal to 0.5VDDQ.
AC OPERATING CONDITIONS (TA=0 to 70 oC, Voltage referenced to VSS = 0V)
Parameter Input High (Logic 1) Voltage, DQ, DQS and DM signals Input Low (Logic 0) Voltage, DQ, DQS and DM signals Input Differential Voltage, CK and /CK inputs Input Crossing Point Voltage, CK and /CK inputs Symbol VIH(AC) VIL(AC) VID(AC) VIX(AC) 0.7 0.5*VDDQ-0.2 Min VREF + 0.31 VREF - 0.31 VDDQ + 0.6 0.5*VDDQ+0.2 Max Unit V V V V 1 2 Note
Note : 1. VID is the magnitude of the difference between the input level on CK and the input on /CK. 2. The value of VIX is expected to equal 0.5*V DDQ of the transmitting device and must track variations in the DC level of the same.
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HYMD264G726B(L)8M-M/K/H/L
AC OPERATING TEST CONDITIONS (TA=0 to 70oC, Voltage referenced to VSS = 0V)
Parameter Reference Voltage Termination Voltage AC Input High Level Voltage (VIH, min) AC Input Low Level Voltage (VIL, max) Input Timing Measurement Reference Level Voltage Output Timing Measurement Reference Level Voltage Input Signal maximum peak swing Input minimum Signal Slew Rate Termination Resistor (RT) Series Resistor (RS) Output Load Capacitance for Access Time Measurement (CL) Value VDDQ x 0.5 VDDQ x 0.5 VREF + 0.31 VREF - 0.31 VREF VTT 1.5 1 50 25 30 Unit V V V V V V V V/ns W W pF
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HYMD264G726B(L)8M-M/K/H/L
CAPACITANCE (TA=25oC, f=100MHz )
Parameter Input Capacitance Input Capacitance Input Capacitance Input Capacitance Input Capacitance Input Capacitance Data Input / Output Capacitance Data Input / Output Capacitance A0 ~ A12, BA0, BA1 /RAS, /CAS, /WE CKE0, CKE1 CS0, CS1 CK0, /CK0 DM0 ~ DM8 DQ0 ~ DQ63, DQS0 ~ DQS8 CB0 ~ CB7 Pin Symbol CIN1 CIN2 CIN3 CIN4 CIN5 CIN6 CIO1 CIO2 Min TBD TBD TBD TBD TBD TBD TBD TBD Max TBD TBD TBD TBD TBD TBD TBD TBD Unit pF pF pF pF pF pF pF pF
Note : 1. VDD = min. to max., VDDQ = 2.3V to 2.7V, VODC = VDDQ/2, VOpeak-to-peak = 0.2V 2. Pins not under test are tied to GND. 3. These values are guaranteed by design and are tested on a sample basis only.
OUTPUT LOAD CIRCUIT
VTT
RT=50
Output Zo=50 VREF
CL=30pF
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HYMD264G726B(L)8M-M/K/H/L
DC CHARACTERISTICS I (TA=0 to 70xC, Voltage referenced to VSS = 0V)
Parameter Input Leakage Current
Add, CMD, /CS, /CKE
Symbol
Min. -2
Max 2
Unit
Note
ILI
CK, /CK
uA -4 4 10 VTT - 0.76 uA V V -10 VTT + 0.76 -
1 2 IOH = -15.2mA IOL = +15.2mA
Output Leakage Current Output High Voltage Output Low Voltage
ILO VOH VOL
Note : 1. VIN = 0 to 3.6V, All other pins are not tested under VIN =0V 2. DOUT is disabled, VOUT=0 to 2.7V
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HYMD264G726B(L)8M-M/K/H/L
DC CHARACTERISTICS II (TA=0 to 70oC, Voltage referenced to VSS = 0V)
Speed Parameter Symbol Test Condition -M
One bank; Active - Precharge; tRC=tRC(min); tCK=tCK(min); DQ,DM and DQS inputs changing twice per clock cycle; address and control inputs changing once per clock cycle One bank; Active - Read - Precharge; Burst Length=2; tRC=tRC(min); tCK=tCK(min); address and control inputs changing once per clock cycle All banks idle; Power down mode; CKE=Low, tCK=tCK(min) /CS=High, All banks idle; tCK=tCK(min); CKE= High; address and control inputs changing once per clock cycle. VIN=VREF for DQ, DQS and DM One bank active; Power down mode; CKE=Low, tCK=tCK(min) /CS=HIGH; CKE=HIGH; One bank; ActivePrecharge; tRC=tRAS(max); tCK=tCK(min); DQ, DM and DQS inputs changing twice per clock cycle; Address and other control inputs changing once per clock cycle Burst=2; Reads; Continuous burst; One bank active; Address and control inputs changing once per clock cycle; tCK=tCK (min); IOUT=0mA Burst=2; Writes; Continuous burst; One bank active; Address and control inputs changing once per clock cycle; tCK=tCK(min); DQ, DM, and DQS inputs changing twice per clock cycle tRC=tRFC(min) - 8*tCK for DDR200 at 100Mhz, 10*tCK for DDR266A & DDR266B at 133Mhz; distributed refresh CKE=<0.2V; External clock on; tCK =tCK(min) Normal Low Power
3620
Unit Note -K -H -L
Operating Current
IDD0
2270
2135
2135
2000
mA
Operating Current
IDD1
2270
2135
2135
2000
mA
Precharge Power Down Standby Current
IDD2P
830
mA
Idle Standby Current
IDD2F
1550
1460
1460
1370
mA
Active Power Down Standby Current
IDD3P
920
mA
Active Standby Current
IDD3N
1730
1640
1640
1550
mA
Operating Current
IDD4R
2720
2495
2495
2360
Operating Current
IDD4W
2810
2675
2675
2540
mA
Auto Refresh Current
IDD5
2510
2375
2375
2240
404 377 3485 .3485 3350
mA mA mA
Self Refresh Current Operating Current Four Bank Operation
IDD6
IDD7
Four bank interleaving with BL=4 Refer to the following page for detailed test condition
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HYMD264G726B(L)8M-M/K/H/L
AC CHARACTERISTICS (AC operating conditions unless otherwise noted)
DDR266(2-2-2) Parameter Row Cycle Time Auto Refresh Row Cycle Time Row Active Time Active to Read with Auto Precharge Delay Row Address to Column Address Delay Row Active to Row Active Delay Column Address to Column Address Delay Row Precharge Time Write Recovery Time Write to Read Command Delay Auto Precharge Write Recovery + Precharge Time System Clock Cycle Time CL = 2.5 tCK CL = 2 tCH tCL tAC 7.5 0.45 0.45 -0.75 12 0.55 0.55 0.75 7.5 0.45 0.45 -0.75 12 0.55 0.55 0.75 10 0.45 0.45 -0.75 12 0.55 0.55 0.75 10 0.45 0.45 -0.8 12 0.55 0.55 0.8 ns CK CK ns Symbol Min tRC tRFC tRAS tRAP 60 75 45 15 Max 120K Min 65 75 45 20 Max 120K Min 65 75 45 20 Max 120K Min 70 80 50 20 Max 120K ns ns ns ns 16 DDR266A DDR266B DDR200
Unit Note
tRCD tRRD tCCD tRP tWR tWTR tDAL
15 15 1 15 15 1
(tWR/tCK) + (tRP/tCK)
12
20 15 1 20 15 1
(tWR/tCK) + (tRP/tCK)
12
20 15 1 20 15 1
(tWR/tCK) + (tRP/tCK)
12
20 15 1 20 15 1
(tWR/tCK) + (tRP/tCK)
12
ns ns CK ns ns CK CK ns 15
7.5
7.5
7.5
8.0
Clock High Level Width Clock Low Level Width Data-Out edge to Clock edge Skew DQS-Out edge to Clock edge Skew DQS-Out edge to Data-Out edge Skew Data-Out hold time from DQS
tDQSCK
-0.75
0.75
-0.75
0.75
-0.75
0.75
-0.8
0.8
ns
tDQSQ
tHP -tQHS min (tCL,tCH) -
0.5
tHPmin -tQHS min (tCL,tCH) -
0.5
tHPmin -tQHS min (tCL,tCH) -
0.5
tHPmin -tQHS min (tCL,tCH) -
0.6
ns
tQH
-
-
-
-
ns
1, 10
Clock Half Period Data Hold Skew Factor Valid Data Output Window Data-out high-impedance window from CK, /CK Data-out low-impedance window from CK, /CK
tHP tQHS tDV tHZ
0.75
0.75
0.75
0.75
ns ns ns ns
1,9 10
tQH-tDQSQ -0.75 0.75
tQH-tDQSQ -0.75 0.75
tQH-tDQSQ -0.75 0.75
tQH-tDQSQ -0.8 0.8
17
tLZ
-0.75
0.75
-0.75
0.75
-0.75
0.75
-0.8
0.8
ns
17
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HYMD264G726B(L)8M-M/K/H/L
AC CHARACTERISTICS (AC operating conditions unless otherwise noted)
DDR266(2-2-2) Parameter Input Setup Time (fast slew rate) Input Hold Time (fast slew rate) Input Setup Time (slow slew rate) Input Hold Time (slow slew rate) Input Pulse Width Write DQS High Level Width Write DQS Low Level Width Clock to First Rising edge of DQS-In Data-In Setup Time to DQS-In (DQ & DM) Data-in Hold Time to DQS-In (DQ & DM) DQ & DM Input Pulse Width Read DQS Preamble Time Read DQS Postamble Time Write DQS Preamble Setup Time Write DQS Preamble Hold Time Write DQS Postamble Time Mode Register Set Delay Exit Self Refresh to Any Execute Command Average Periodic Refresh Interval Note : 1. 2. 3. 4. This calculation accounts for tDQSQ(max), the pulse width distortion of on-chip circuit and jitter. Data sampled at the rising edges of the clock : A0~A12, BA0~BA1, CKE, /CS, /RAS, /CAS, /WE. For command/address input slew rate >=1.0V/ns For command/address input slew rate >=0.5V/ns and <1.0V/ns This derating table is used to increase tIS/tIH in case where the input slew-rate is below 0.5V/ns. Input Setup / Hold Slew-rate Derating Table. Input Setup / Hold Slew-rate V/ns 0.5 0.4 0.3 Delta tIS ps 0 +50 +100 Delta tIH ps 0 0 0 Symbol Min tIS tIH tIS tIH tIPW tDQSH tDQSL tDQSS 0.9 0.9 1.0 1.0 2.2 0.35 0.35 0.72 1.28 Max Min 0.9 0.9 1.0 1.0 2.2 0.35 0.35 0.75 1.25 Max Min 0.9 0.9 1.0 1.0 2.2 0.35 0.35 0.75 1.25 Max Min 1.1 1.1 1.1 1.1 2.5 0.35 0.35 0.75 1.25 Max ns ns ns ns ns CK CK CK 6,7, 11~13 6,7, 11~13 2,3,5,6 2,3,5,6 2,4,5,6 2,4,5,6 6 DDR266A DDR266B DDR200
Unit Note
- continued -
tDS
0.5
-
0.5
-
0.5
-
0.6
-
ns
tDH tDIPW tRPRE tRPST tWPRES tWPREH tWPST tMRD tXSC tREFI
0.5 1.75 0.9 0.4 0 0.25 0.4 2 200 -
1.1 0.6 0.6 15.6
0.5 1.75 0.9 0.4 0 0.25 0.4 2 200 -
1.1 0.6 0.6 15.6
0.5 1.75 0.9 0.4 0 0.25 0.4 2 200 -
1.1 0.6 0.6 15.6
0.6 2 0.9 0.4 0 0.25 0.4 2 200 -
1.1 0.6 0.6 15.6
ns ns CK CK CK CK CK CK CK us
8
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HYMD264G726B(L)8M-M/K/H/L
5. 6. CK, /CK slew rates are >=1.0V/ns These parameters quarantee device timing, but they are not necessarily tested on each device, and they may be quaranteed by design or tester correlation. Data latched at both rising and falling edges of Data Strobes(LDQS/UDQS) : DQ, LDM/UDM. Minimum of 200 cycles of stable input clocks after Self Refresh Exit command, where CKE is held high, is required to complete Self Refresh Exit and lock the internal DLL circuit of DDR SDRAM. Min (tCL, tCH) refers to the smaller of the actual clock low time and the actual clock high time as provided to the device (i.e. this value can be greater than the minimum specification limits for tCL and tCH). tHP = minimum half clock period for any given cycle and is defined by clock high or clock low (tCH, tCL). tQHS consists of tDQSQmax, the pulse width distortion of on-chip clock circuits, data pin to pin skew and output pattern effects and p-channel to n-channel variation of the output drivers. This derating table is used to increase tDS/tDH in case where the input slew-rate is below 0.5V/ns. Input Setup / Hold Slew-rate Derating Table. Input Setup / Hold Slew-rate V/ns 0.5 0.4 0.3 Delta tDS ps 0 +75 +150 Delta tDH ps 0 +75 +150
7. 8.
9.
10.
11.
12.
I/O Setup/Hold Plateau Derating. This derating table is used to increase tDS/tDH in case where the input level is flat below VREF +/-310mV for a duration of up to 2ns. I/O Input Level mV +280 Delta tDS ps +50 Delta tDH ps +50
13.
I/O Setup/Hold Delta Inverse Slew Rate Derating. This derating table is used to increase tDS/tDH in case where the DQ and DQS slew rates differ. The Delta Inverse Slew Rate is calculated as (1/SlewRate1)-(1/SlewRate2). For example, if slew rate 1=0.5V/ns and Slew Rate2 = 0.4V/n then the Delta Inverse Slew Rate = -0.5ns/V. (1/SlewRate1)-(1/SlewRate2) ns/V 0 +/-0.25 +/- 0.5 Delta tDS ps 0 +50 +100 Delta tDH ps 0 +50 +100
14.
DQS, DM and DQ input slew rate is specified to prevent double clocking of data and preserve setup and hold times. Signal transi tions through the DC region must be monotonic. tDAL = (tDPL / tCK ) + (tRP / tCK ). For each of the terms above, if not already an integer, round to the next highest integer. tCK is equal to the actual system clock cycle time. Example: For DDR266B at CL=2.5 and tCK = 7.5 ns, tDAL = (15 ns / 7.5 ns) + (20 ns / 7.5 ns) = (2.00) + (2.67) Round up each non-integer to the next highest integer: = (2) + (3), tDAL = 5 clock For the parts which do not has internal RAS lockout circuit, Active to Read with Auto precharge delay should be tRAS - BL/2 x tCK. tHZ and tLZ transitions occur in the same access time windows as valid data trasitions. These parameters are not referenced to a specific voltage level but specify when the device output is no longer driving (HZ), or begins driving (LZ).
15.
16.
17.
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HYMD264G726B(L)8M-M/K/H/L
SIMPLIFIED COMMAND TRUTH TABLE
Command Extended Mode Register Set Mode Register Set Device Deselect H No Operation Bank Active Read H Read with Autoprecharge Write H Write with Autoprecharge Precharge All Banks H Precharge selected Bank Read Burst Stop Auto Refresh Entry Self Refresh Exit L H L H Entry Precharge Power Down Mode Exit L H L H Active Power Down Mode Entry Exit H L L L H V X V V X 1 1 H X H X H X 1 1 H L L H H X H X H X X 1 1 H X H X H X 1 H H H X H L L L L H H L L X H L L X L H H X X 1 X L L H L X L X X V 1 1 1 1 X L H L L CA H H X X L H L H CA H L V 1,4 1,5 H X X L L H L H H H H RA L V 1,3 1 V 1 1 CKEn-1 H H CKEn X X /CS L L H /RAS L L X /CAS L L X /WE L L X X 1
ADDR
A10/ AP OP code OP code
BA
Note 1,2 1,2
( H=Logic High Level, L=Logic Low Level, X=Don't Care, V=Valid Data Input, OP Code=Operand Code, NOP=No Operation ) Note : 1. DM states are Don't Care. Refer to below Write Mask Truth Table. 2. OP Code(Operand Code) consists of A0~A12 and BA0~BA1 used for Mode Registering duing Extended MRS or MRS. Before entering Mode Register Set mode, all banks must be in a precharge state and MRS command can be issued after tRP period from Prechagre command. 3. If a Read with Autoprecharge command is detected by memory component in CK(n), then there will be no command presented to activated bank until CK(n+BL/2+tRP). 4. If a Write with Autoprecharge command is detected by memory component in CK(n), then there will be no command presented to activated bank until CK(n+BL/2+1+tDPL+tRP). Last Data-In to Prechage delay(tDPL) which is also called Write Recovery Time (tWR) is needed to guarantee that the last data has been completely written. 5. If A10/AP is High when Row Precharge command being issued, BA0/BA1 are ignored and all banks are selected to be precharged.
Rev. 0.1 / Oct. 2003
12
HYMD264G726B(L)8M-M/K/H/L
PACKAGE DIMENSIONS
Front
133.35 5.25
Register
30.48 1.2
PLL
Back
Side
3.99 0.157max
(Front)
Register
4.24 0.167 1.27 0.050
Note) All dimension are typical unless otherwise stated.
Millimeters Inches
Rev. 0.1 / Oct. 2003
13
SERIAL PRESENCE DETECT
SPD SPECIFICATION
(64Mx72 Low Profile REG. DDR DIMM)
Rev. 0.1 / Oct. 2003
14
HYMD264G726B(L)8M-M/K/H/L
SERIAL PRESENCE DETECT
Byte# Function Description M 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 41 42 43 44 45 62 63 Number of Bytes written into serial memory at module manufacturer Total number of Bytes in SPD device Fundamental memory type Number of row address on this assembly Number of column address on this assembly Number of physical banks on DIMM Module data width Module data width (continued) Module voltage Interface levels(VDDQ) DDR SDRAM cycle time at CAS Latency=2.5(tCK) DDR SDRAM access time from clock at CL=2.5 (tAC) Module configuration type Refresh rate and type Primary DDR SDRAM width Error checking DDR SDRAM data width Minimum clock delay for back-to-back random column address(tCCD) Burst lengths supported Number of banks on each DDR SDRAM CAS latency supported CS latency WE latency DDR SDRAM module attributes DDR SDRAM device attributes : General DDR SDRAM cycle time at CL=2.0(tCK) DDR SDRAM access time from clock at CL=2.0(tAC) DDR SDRAM cycle time at CL=1.5(tCK) DDR SDRAM access time from clock at CL=1.5(tAC) Minimum row precharge time(tRP) Minimum row activate to row active delay(tRRD) Minimum RAS to CAS delay(tRCD) Minimum active to precharge time(tRAS) Module row density Command and address signal input setup time(tIS) Command and address signal input hold time(tIH) Data signal input setup time(tDS) Data signal input hold time(tDH) Minimum active / auto-refresh time ( tRC) Minimum auto-refresh to active/auto-refresh command period(tRFC) Maximum cycle time (tCK max) Maximim DQS-DQ skew time(tDQSQ) Maximum read data hold skew factor(tQHS) SPD Revision code Checksum for Bytes 0~62 0.9ns 0.9ns 0.5ns 0.5ns 60ns 75ns 12ns 0.5ns 0.75ns 15ns 15ns 15ns 45ns 20ns 15ns 20ns 45ns 0.9ns 0.9ns 0.5ns 0.5ns 65ns 75ns 12ns 0.5ns 0.75ns 7.5ns 7.5ns +/-0.75ns ECC 7.8us & Self refresh x8 x8 1 CLK 2,4,8 4 Banks 2, 2.5 0 1 Registered, PLL +/-0.2Voltage tolerance, Concurrent Auto Precharge tRAS Lock Out 7.5ns 7.5ns +/-0.75ns 20ns 15ns 20ns 45ns 0.9ns 0.9ns 0.5ns 0.5ns 65ns 75ns 12ns 0.5ns 0.75ns 20ns 15ns 20ns 50ns 1.1ns 1.1ns 0.6ns 0.6ns 70ns 80ns 12ns 0.6ns 0.75ns 3Ch 3Ch 3Ch 2Dh 90h 90h 50h 50h 3Ch 4Bh 30h 32h 75h 50h 3Ch 50h 2Dh 40h 90h 90h 50h 50h 00h 41h 4Bh 30h 32h 75h 00h 00h A3h D0h FBh 95h 41h 4Bh 30h 32h 75h 46h 50h 30h 3Ch 75h 90h 90h 50h 50h B0h B0h 60h 60h 10ns 10ns +/-0.8ns 75h 75h 75h 75h 00h 00h 50h 3Ch 50h 2Dh 50h 3Ch 50h 32h K H L M K 80h 08h 07h 0Dh 0Ah 02h 48h 00h 04h 8.0ns +/-0.8ns 75h 75h 75h 75h 02h 82h 08h 08h 01h 0Eh 04h 0Ch 01h 02h 26h C0h A0h 75h A0h 80h 2 2 2 2 75h 75h 80h 80h 2 2 7.5ns 1 1 H L
Bin Sort :M(DDR266(2-2-2),K(DDR266A@CL=2) H(DDR266B@CL=2.5),L(DDR200@CL=2)
Function Supported Hexa Value Note
128 Bytes 256 Bytes DDR SDRAM 13 10 2Bank 72 Bits SSTL 2.5V
256MB
36~40 Reserved for VCSDRAM
Undefined
46~61 Superset information(may be used in future)
Undefined Initial release -
Rev. 0.1 / Oct. 2003
15
HYMD264G726B(L)8M-M/K/H/L
SERIAL PRESENCE DETECT
Function Supported Byte # 64 65~71 Function Description M Manufacturer JEDEC ID Code --------- Manufacturer JEDEC ID Code K H L M K ADh 00h 0*h 1*h 2*h 3*h 4*h 5*h 48h 59h 4Dh 44h 32h 36h 34h 47h 37h 32h 36h 42h 38h 4Dh 2Dh H Blank Undefined Undefined L 4Dh 4Bh 20h 00h 00h 3 3 4 5 5 48h 4Ch H L Hynix JEDEC ID Hynix(Korea Area) HSA(United States Area) HSE(Europe Area) HSJ(Japan Area) Singapore Asia Area H Y M D 2 6 4 G 7 2 6(8K refresh,4Bank) B 8 M `-' M K Hexa Value Note
- continued -
72
Manufacturing location
6
73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89~90 91 92 93 94 95~98 99~127
Manufacture part number(Hynix Memory Module) -------- Manufacture part number(Hynix Memory Module) -------- Manufacture part number(Hynix Memory Module) Manufacture part number (DDR SDRAM) Manufacture part number(Memory density) Manufacture part number(Module Depth) ------- Manufacture part number(Module Depth) Manufacture part number(Module type) Manufacture part number(Data width) -------Manufacture part number(Data width) Manufacture part number(Refresh, # of Bank.) Manufacture part number(Component Generation) Manufacture part number(Component configuration) Manufacture part number(Low Profile) Manufacture part number(Hyphen) Manufacture part number(Minimum cycle time) Manufacture part number(T.B.D) Manufacture revision code(for Component) Manufacture revision code (for PCB) Manufacturing date(Year) Manufacturing date(Week) Module serial number Manufacturer specific data (may be used in future)
128~255 Open for customer use Note : 1. The bank address is excluded 2. This value is based on the component specification 3. These bytes are programmed by code of date week & date year 4. These bytes apply to Hynix's own Module Serial Number system 5. These bytes undefined and coded as `00h' 6. Refer to Hynix Web Site
Byte 85~86, Low power part
Function Supported Byte # 85 86 Function Description M Manufacture part number(Low power part) Manufacture part number(Component configuration) K L 8 H L M K 4Ch 38h H L Hexa Value Note
Rev. 0.1 / Oct. 2003
16

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